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d a t a sh eet product speci?cation file under integrated circuits, ic02 october 1992 integrated circuits TSA5512 1.3 ghz bidirectional i 2 c-bus controlled synthesizer
october 1992 2 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 features complete 1.3 ghz single chip system low power 5 v, 35 ma i 2 c-bus programming in-lock flag varicap drive disable low radiation address selection for picture-in-picture (pip), dbs tuner (3 addresses) analog-to-digital converter 8 bus controlled ports (6 for TSA5512t), 8 open collector outputs (4 bidirectional) power-down flag applications tv tuners vcr tuners description the TSA5512 is a single chip pll frequency synthesizer designed for tv tuning systems. control data is entered via the i 2 c-bus; five serial bytes are required to address the device, select the oscillator frequency, programme the eight output ports and set the charge-pump current. four of these ports can also be used as input ports (three general purpose i/o ports, one adc). digital information concerning those ports can be read out of the TSA5512 on the sda line (one status byte) during a read operation. a flag is set when the loop is in-lock and is read during a read operation. the device has one fixed i 2 c-bus address and 3 programmable addresses, programmed by applying a specific voltage on port 3. the phase comparator operates at 7.8125 khz when a 4 mhz crystal is used. ordering information note 1. sot102-1; 1996 december 5. 2. sot109-1; 1996 december 5. 3. sot163-1; 1996 december 5. 4. sot266-1; 1996 december 5. extended type number package pins pin position material code TSA5512 18 dil plastic sot102 (1) TSA5512t 16 so plastic sot109a (2) TSA5512at 20 so plastic sot163a (3) TSA5512m 20 ssop plastic sot266 (4)
october 1992 3 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 quick reference data symbol parameter min. typ. max. unit v cc supply voltage - 5 - v i cc supply current - 35 - ma d fr frequency range 64 - 1300 mhz v i input voltage level 80 mhz to 150 mhz 12 - 300 mv 150 mhz to 1 ghz 9 - 300 mv 1 ghz to 1.3 ghz 40 - 300 mv f xtal crystal oscillator frequency 3.2 4.0 4.48 mhz i o open-collector output current 5 -- ma t amb operating ambient temperature range - 10 - +80 c t stg ic storage temperature range - 40 - +150 c
october 1992 4 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 fig.1 block diagram.
october 1992 5 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 fig.2 pin configuration for sot102. fig.3 pin configuration for sot109. fig.4 pin configuration for sot163/sot266.
october 1992 6 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 pinning functional description the TSA5512 is controlled via the two-wire i 2 c-bus. for programming, there is one module address (7 bits) and the r/ w bit for selecting read or write mode. write mode: r/ w = 0 (see table 1) after the address transmission (first byte), data bytes can be sent to the device. four data bytes are required to fully program the TSA5512. the bus transceiver has an auto-increment facility which permits the programming of the TSA5512 within one single transmission (address + 4 data bytes). the TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2 or byte 4. the meaning of the bits in the data bytes is given in table 1. the first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. until an i 2 c-bus stop condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. this allows a smooth frequency sweep for fine tuning or afc purpose. at power-on the ports are set to the high impedance state. the 7.8125 khz reference frequency is obtained by dividing the output of the 4 mhz crystal oscillator by 512. because the input of uhf/vhf signal is first divided by 8 the step size is 62.5 khz. a 3.2 mhz crystal can offer step sizes of 50 khz. symbol pin description sot102 sot109 sot163 sot266 pd 1 1 1 charge-pump output q1 2 2 2 crystal oscillator input 1 q2 3 3 3 crystal oscillator reference voltage n.c. -- 4 not connected sda 4 4 5 serial data input/output scl 5 5 6 serial clock input p7 6 6 7 port output/input (general purpose) n.c. -- 8 not connected p6 7 7 9 port output/input for general purpose adc p5 8 8 10 port output/input (general purpose) p4 9 9 11 port output/input (general purpose) p3 10 10 12 port output/input for address selection p2 11 11 13 port output p1 12 - 14 port output p0 13 - 15 port output v cc 14 12 16 voltage supply rf in1 15 13 17 uhf/vhf signal input 1 rf in2 16 14 18 uhf/vhf signal input 2 (decoupled) v ee 17 15 19 ground ud 18 16 20 drive output
october 1992 7 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 table 1 write data format note to table 1 msb lsb address 11000ma1ma00a byte 1 programmable divider 0 n14 n13 n12 n11 n10 n9 n8 a byte 2 programmable divider n7 n6 n5 n4 n3 n2 n1 n0 a byte 3 charge-pump and test bits 1 cp t1 t0 1 1 1 os a byte 4 output ports control bits p7 p6 p5 p4 p3 p2 p1* p0* a byte 5 * not valid for TSA5512t ma1,mao programmable address bits (see table 4) a acknowledge bit n14 to n0 programmable divider bits n = n14 2 14 + n13 2 13 +... +n1 2 1 + no cp charge-pump current cp = 0 50 m a cp = 1 220 m a p7 to p0 = 1 open-collector output is active p7 to p0 = 0 outputs are in high impedance state t1, t0, os = 0 0 0 normal operation t1 = 1 p6 = f ref , p7 = f div t0 = 1 3-state charge-pump os = 1 operational ampli?er output is switched off (varicap drive disable)
october 1992 8 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 read mode: r/ w = 1 (see table 2) data can be read out of the TSA5512 by setting the r/ w bit to 1. after the slave address has been recognized, the TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the sda line (msb first). data is valid on the sda line during a high position of the scl clock signal. a second data byte can be read out of the TSA5512 if the processor generates an acknowledge on the sda line. end of transmission will occur if no acknowledge from the processor occurs. the TSA5512 will then release the data line to allow the processor to generate a stop condition. when ports p3 to p7 are used as inputs, they must be programmed in their high-impedance state. the por flag (power-on reset) is set to 1 when v cc goes below 3 v and at power-on. it is reset when an end of data is detected by the TSA5512 (end of a read sequence). control of the loop is made possible with the in-lock flag fl which indicates (fl = 1) when the loop is phase-locked. the bits i2, i1 and i0 represent the status of the i/o ports p7, p5 and p4 respectively. a logic 0 indicates a low level and a logic 1 a high level (ttl levels). a built-in 5-level adc is available on i/o port p6. this converter can be used to feed afc information to the controller from the if section of the television as illustrated in the typical application circuit (fig.8). the relationship between bits a2, a1 and a0 and the input voltage on port p6 is given in table 3. table 2 read data format note to table 2 msb is transmitted first address selection the module address contains programmable address bits (ma1 and ma0) which together with the i/o port p3 offers the possibility of having several synthesizers (up to 3) in one system. the relationship between ma1 and ma0 and the input voltage i/o port p3 is given in table 4 msb lsb address 11000ma1ma01a byte 1 status byte por fl i2 i1 i0 a2 a1 a0 - byte 2 por power-on reset ?ag. (por = 1 on power-on) fl in-lock ?ag (fl = 1 when the loop is phase-locked) i2, i1, i0 digital information for i/o ports p7, p5 and p4 respectively a2, a1 a0 digital outputs of the 5-level adc. accuracy is 1/2 lsb (see table 3)
october 1992 9 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 table 3 adc levels table 4 address selection limiting values in accordance with absolute maximum rating system (iec 134); all pin numbers refer to dil18 version thermal resistance voltage applied on the port p6 a2 a1 a0 0.6 v cc to 13.5 v 1 0 0 0.45 v cc to 0.6 v cc 011 0.3 v cc to 0.45 v cc 010 0.15 v cc to 0.3 v cc 001 0 to 0.15 v cc 000 ma1 ma0 voltage applied on port p3 0 0 0 to 0.1 v cc 0 1 always valid 1 0 0.4 to 0.6 v cc 1 1 0.9 v cc to 13.5 v symbol parameter min. max. unit v cc supply voltage - 0.3 6 v v 1 charge-pump output voltage - 0.3 v cc v v 2 crystal (q1) input voltage - 0.3 v cc v v 4 serial data input/output voltage - 0.3 6 v v 5 serial clock input voltage - 0.3 6 v v 6-13 p7 to p0 input/output voltage - 0.3 +16 v v 15 prescaler input voltage - 0.3 v cc v v 18 drive output voltage - 0.3 v cc v i 6-13 p7 to p0 output current (open collector) - 115ma i 4 sda output current (open collector) - 15 ma t stg ic storage temperature range - 40 +150 c t j maximum junction temperature - 150 c symbol parameter thermal resistance r th j-a from junction to ambient in free air dil18 80 k/w so16 110 k/w so20 80 k/w ssop20 120 k/w
october 1992 10 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 characteristics v cc = 5v;t amb = 25 c, unless otherwise speci?ed all pin numbers refer to dil18 version symbol parameter conditions min. typ. max. unit functional range v cc supply voltage range 4.5 - 5.5 v t amb operating ambient temperature range - 10 - +80 c f input frequency 64 - 1300 mhz n divider 256 - 32767 i cc supply current 25 35 50 ma f xtal crystal oscillator frequency range crystal series resonance resistance 150 w 3.2 4.0 4.48 mhz z i input impedance (pin 2) - 480 - 400 - 320 w input level v cc = 4.5 v to 5.5 v; t amb = - 10 to +80 c; see typical sensitivity curve fig.6 f = 80 to 150 mhz 12/ - 25 - 300/2.6 mv/dbm f = 150 to 1000 mhz 9/ - 28 - 300/2.6 mv/dbm f = 1000 to 1300 mhz 40/ - 15 - 300/2.6 mv/dbm r i prescaler input resistance (see fig.7) - 50 -w c i input capacitance - 2 - pf output ports (open collector) p0 to p7 (see note 1) i lo output leakage current v o = 13.5 v -- 10 m a v ol low level output voltage i ol = 5 ma; note 2 -- 0.7 v input port p3 i oh high level input current v oh = 13.5 v -- 10 m a i ol low level input current v ol = 0 v - 10 --m a input ports p4, p5 and p7 v il low level input voltage -- 0.8 v v ih high level input voltage 2.7 -- v i ih high level input current v ih = 13.5 v -- 10 m a i il low level input current v il = 0 v - 10 --m a input port p6 i ih high level input current v ih = 13.5 v -- 10 m a i il low level input current v il = 0 v - 10 --m a scl and sda inputs v ih high level input voltage 3.0 - 5.5 v v il low level input voltage -- 1.5 v
october 1992 11 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 notes to the characteristics 1. when a port is active, the collector voltage must not exceed 6 v. 2. measured with all open-collector ports active. scl and sda inputs i ih high level input current v ih = 5 v; v cc = 0 v -- 10 m a v ih = 5 v; v cc = 5 v -- 10 m a i il low level input current v il = 0v;v cc = 0 v - 10 --m a v il = 0v;v cc = 5 v - 10 --m a output sda (pin 4; open collector) i lo output leakage current v o = 5.5 v -- 10 m a v o output voltage i o = 3 ma -- 0.4 v charge-pump output pd (pin 1) i oh high level output current (absolute value) cp = 1 90 220 300 m a i ol low level output current (absolute value) cp = 0 22 50 75 m a v 1 output voltage in-lock 1.5 - 2.5 v i 1leak off-state leakage current t0 = 1 - 5 - 5na operational ampli?er output ud (test mode t0 = 1) v 18 output voltage v il = 0 v -- 100 mv v 18 output voltage when switched-off os = 1; v il = 2 v -- 200 mv g operational ampli?er current gain; i 18 /(i 1 - i 1leak ) os = 0; v il = 2 v; i 18 = 10 m a 2000 -- symbol parameter conditions min. typ. max. unit
october 1992 12 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 fig.5 typical application (dil18).
october 1992 13 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 fig.6 prescaler typical input sensitivity curve; v cc = 4.5 to 5.5 v; t amb = - 10 to +80 c. fig.7 prescaler smith chart of typical input impedance; v cc = 5 v; reference value = 50 w .
october 1992 14 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 flock flag definition (fl) when the fl flag is 1, the maximum frequency deviation ( d f) from stable frequency can be expressed as follows: where: flock flag application k vco = 16 mhz/v (uhf band) i cp = 220 ma c1 = 180 nf c2 = 39 nf d f = 27.5 khz. table 5 flock ?ag settings k vco = oscillator slope (hz/v) i cp = charge-pump current (a) k o =4 10e6 c1 and c2 = loop ?lter capacitors (see fig.8) min. max. unit time span between actual phase lock and fl-?ag setting 1024 1152 m s time span between the loop losing lock and fl-?ag resetting 0 128 m s d fk vco k o () i cp c1 c2 + () c1 c2 () = fig.8 loop filter.
october 1992 15 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 package outline references outline version european projection issue date iec jedec eiaj sot102-1 93-10-14 95-01-23 unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 3.9 3.4 0.254 2.54 7.62 8.25 7.80 9.5 8.3 0.85 4.7 0.51 3.7 inches 0.055 0.044 0.021 0.015 0.013 0.009 1.40 1.14 0.055 0.044 0.86 0.84 0.26 0.24 0.15 0.13 0.01 0.10 0.30 0.32 0.31 0.37 0.33 0.033 0.19 0.020 0.15 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 18 1 10 9 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. dip18: plastic dual in-line package; 18 leads (300 mil) sot102-1
october 1992 16 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot109-1 95-01-23 97-05-22 076e07s ms-012ac 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale so16: plastic small outline package; 16 leads; body width 3.9 mm sot109-1
october 1992 17 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013ac pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 95-01-24 97-05-22
october 1992 18 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 unit a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0 1.4 1.2 0.32 0.20 0.20 0.13 6.6 6.4 4.5 4.3 0.65 1.0 0.2 6.6 6.2 0.65 0.45 0.48 0.18 10 0 o o 0.13 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.20 mm maximum per side are not included. 0.75 0.45 sot266-1 90-04-05 95-02-25 w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a x (a ) 3 a y 0.25 110 20 11 pin 1 index 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 4.4 mm sot266-1 a max. 1.5
october 1992 19 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so and ssop r eflow soldering reflow soldering techniques are suitable for all so and ssop packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering is not recommended for ssop packages. this is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. if wave soldering cannot be avoided, the following conditions must be observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. even with these conditions, only consider wave soldering ssop packages that have a body width of 4.4 mm, that is ssop16 (sot369-1) or ssop20 (sot266-1) . during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
october 1992 20 philips semiconductors product speci?cation 1.3 ghz bidirectional i 2 c-bus controlled synthesizer TSA5512 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. purchase of philips i 2 c components data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. purchase of philips i 2 c components conveys a license under the philips i 2 c patent to use the components in the i 2 c system provided the system conforms to the i 2 c specification defined by philips. this specification can be ordered using the code 9398 393 40011.

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